2
Current inputs
Continuous and peak/overload currents are compared with a 10A page reference, not a confirmed drive rating.
Current Screen + Guide
10A Board Level Servo Drive Calculator
Compare phase current with a 10A reference; verify product ratings before selection.
Published July 19, 2026; evidence reviewed October 11, 2026.
Ready to Screen a 10A Board
This tool compares entered currents with a 10A reference.No result yet. Enter the duty-cycle values and run the current reference screen.Next step: Use the supplier overload curve and thermal data for final selection.
Continuous current vs 10A referenceAwaiting input
Enter the continuous phase current in Arms.
Peak current vs 10A referenceAwaiting input
Enter overload current using the same RMS convention.
Peak/overload durationAwaiting input
Use the supplier overload curve or I²t data to validate duration.
Assumptions shown in result
- - Enter continuous and peak/overload phase current using the same RMS convention.
- - 10A is a comparison point only, not a verified product rating.
- - Thermal, voltage, feedback, and protocol compatibility are not calculated.
3
Thermal options
Bare PCB, chassis pad, and cold plate are context choices; the tool does not simulate thermal performance.
6
Supplier checks
The supplier checklist covers rating definitions, thermal path, connector derating, bus regeneration, and interface requirements.
Decision Summary
Key Takeaways for Board-Level Integration
Part data
Connector limits
Select phase connectors by the exact terminal rating, wire, temperature, and duty cycle. Pitch alone does not establish current capacity; confirm the complete connection path.
Validate
Board thermal path
Board current and temperature depend on conductor geometry, copper stackup, mounting, ambient conditions, and permitted temperature rise. Request design-specific analysis and test data.
Design dependent
GaN trade-off
GaN can enable higher switching frequency or power density in a suitable design, but system efficiency depends on the device, operating point, control, and layout. Compare measured system data.
How the Tool Decides
The calculator compares current only. Thermal-interface selection provides context, but a real board rating depends on the exact design, operating conditions, and supplier test data.
| Input | Why it matters | Screening rule |
|---|---|---|
| Continuous current | Contributes to average copper and semiconductor losses over the operating duty cycle. | Compared with the page’s 10A reference only. Confirm the drive’s continuous rating at the actual bus voltage, speed, mounting, and ambient temperature. |
| Peak/overload current | A short-time rating depends on the drive’s overload curve, duration, repetition, and current convention. | Compared with the 10A reference; separately confirm peak current, allowed duration, and duty cycle with the supplier. |
| Peak duration | The same peak current can impose different electrical and thermal stress at different pulse durations and repetition rates. | No universal duration limit is inferred. Check the product overload curve or I²t data for the complete duty cycle. |
| Thermal Interface | The mounting and heat path affect temperature, but this tool has no loss, geometry, ambient, or thermal-resistance model. | Selection adds context to the result only. Validate the mounted assembly using supplier data and thermal testing. |
Evidence Layer
Sources, Scope, and Known Limits
The page separates general engineering rules for PCB ampacity from vendor-specific ratings. IPC standards support the copper thickness realities, but supplier datasheets must confirm the exact connector and TIM requirements.
Review cycle: refreshed every six months, or sooner when thermal interface materials or PCB manufacturing standards change.
| Source | Supports | Boundary | Date note |
|---|---|---|---|
| IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design | Trace width, copper thickness, board construction, and temperature rise dictate how much continuous current a bare board can carry. | This standard describes how conductor geometry and temperature rise affect current capacity; it does not establish one universal 10A trace rule. | Official source checked October 11, 2026 |
| IPC document revision table — IPC-2152 status | IPC identifies the document revision status for IPC-2152. | IPC lists IPC-2152 as no longer maintained. Treat it as a historical design reference and confirm current applicable requirements and board-specific thermal data. | Official status checked October 11, 2026 |
| Henkel BERGQUIST thermal gap pad materials | Gap pad properties are specific to the selected material; the component data does not by itself establish a safe drive current or junction temperature. | Thermal conductivity, thickness, compression, and contact conditions are product-specific. Select a pad from its datasheet and validate the complete board-to-housing interface. | Official material page checked October 11, 2026 |
| JST GH series product specification | Use the exact contact and wire specification, then apply its current, ambient-temperature, and loaded-circuit derating conditions. | JST lists 1A AC/DC for the GH series with AWG #26. This is a series- and wire-specific rating, not a rule that applies to every 1.25mm connector. | Official product page checked October 11, 2026 |
| Texas Instruments TIDA-00909 reference design | The reference design documents a specific 48V/10A high-frequency inverter and its stated peak efficiency; results depend on the design and test conditions. | TI’s TIDA-00909 is one 48V/10A GaN inverter reference design, reporting up to 98.5% peak efficiency at 100kHz PWM. This is not a general GaN-versus-silicon gain or a guarantee for another design. | Official reference design checked October 11, 2026 |
| Molex Micro-Fit 3.0 system product specification | Use the exact terminal specification and application conditions rather than treating connector pitch as an ampacity rating. | Molex lists up to 8.5A for the Micro-Fit 3.0 family, with the specific rating determined by the terminal. The connector name or pitch therefore does not establish a 10A application rating. | Official specification checked October 11, 2026 |
If your result is a boundary case, package the duty cycle, thermal interface plan, and mounting CAD before asking for a written supplier rating.
Send integration specsTrade-Off Analysis
Standard vs 10A Board Level Decision Points
Pushing 10A through a board fundamentally changes the PCB stackup, connector height, and mechanical mounting strategy compared to a lower-current board.
| Parameter | Other drive options | 10A board-level option | Decision impact |
|---|---|---|---|
| PCB Construction | Often housed separately; check the product drawing | Board and housing are integrated into the actuator | Board construction and thermal behavior vary by design; compare the actual stackup, copper geometry, mounting, and measured temperature rise. |
| Phase Connectors | Select contacts for the rated current and harness | Check the exact terminal and board interconnect rating | Current capacity depends on the selected connector contacts, wire, temperature, and duty—not pitch alone. |
| Thermal Integration | Use the supplier’s specified mounting and airflow | Validate the board in its final housing and thermal stack | Thermal requirements depend on actual losses, duty, ambient temperature, and the enclosure; neither active nor passive cooling is universally sufficient. |
| DC Bus Capacitance | Check bus and braking specifications | Check bus rise and braking needs in the target actuator | Regenerative energy and bus-voltage rise depend on inertia, deceleration, bus capacitance, and braking strategy. |
| Integration Cost | May simplify the actuator housing | May reduce wiring while adding integration and test effort | Board integration can shorten motor wiring but adds mechanical, thermal, and validation work; quantify cost against the complete system. |
Integration Boundaries and Next Actions
| Tool result | Typical condition | Required action |
|---|---|---|
| Within 10A reference | Both entered current values are at or below the 10A reference. | Request the actual continuous and overload ratings, thermal conditions, and mechanical drawing. |
| Boundary case | A continuous or overload input is close to 10A, or the board has no defined conductive thermal path. | Request the overload curve or I²t rating, board stackup, and thermal test results in the intended mounting. |
| Outside envelope | Either current input exceeds the page’s 10A reference. | Compare a higher-rated drive using its continuous and overload curves for the full duty cycle. |
| Below reference; compare smaller options | Both required currents are well below the reference and a smaller product may meet the same voltage, feedback, and thermal requirements. | Compare a smaller current-rated drive if its verified ratings cover the duty cycle. |
Integration Risk Map
The highest-impact mistakes for bare boards are usually poor TIM contact, under-rated connectors, and unprotected EMI, rather than just the silicon FET rating.
| Risk | Trigger | Mitigation |
|---|---|---|
| Excess component or board temperature | Thermal path, board geometry, ambient temperature, or duty cycle differs from the supplier test conditions | Obtain the board loss and thermal data, define the interface and mounting pressure, then test the assembled unit at worst-case ambient and duty. |
| Connector or harness overheating | Selecting by connector pitch or family name without checking the exact contact rating and application conditions | Check the exact connector and terminal datasheet for wire size, number of loaded contacts, ambient, and current derating; test the harness at the intended duty. |
| DC bus over-voltage during regeneration | High deceleration energy with no space for large capacitors on the PCB | Model worst-case regenerative energy and confirm bus-voltage limits, capacitance, and braking requirements with the supplier. |
| EMC interference | High-frequency GaN switching on a bare board inside a non-metallic joint | Review the switching edge, return path, layout, cable routing, and enclosure against the drive manufacturer’s EMC guidance; test the final assembly. |
Hardware Check
Questions to Ask Before Selecting a 10A Board
| Question | Why it matters |
|---|---|
| What are the continuous and peak/overload current ratings, their RMS convention, allowed duration, and repetition rate? | A single 10A label does not say whether a rating is continuous or short-time, or under which bus, ambient, and mounting conditions it applies. |
| What exact connector, terminal, and wire combination is rated for the phase current? | Ampacity depends on the specific contacts and application conditions. Ask for the part number and derating data, not just connector pitch. |
| What board stackup, copper geometry, and thermal test conditions support the stated current rating? | Trace/plane geometry, vias, mounting, ambient, and permitted temperature rise affect the board current limit. |
| What thermal interface material, thickness, compression, and mounting pressure are specified? | The chosen pad and mounting stack must match the supplier’s thermal characterization and mechanical limits. |
| What bus-voltage rise and braking strategy should I expect during regeneration? | Confirm required capacitance or braking hardware for the motor inertia and deceleration profile. |
| Which bus voltage, feedback device, and control protocol does the drive support? | The calculator checks current only. Voltage, encoder, and communication compatibility must be confirmed separately. |
Scenario Checks
Example Integration Outcomes
Illustrative inputs only; these are screening examples, not measured hardware results or customer cases.
| Case | Input assumption | Outcome |
|---|---|---|
| Lightweight robot joint | 5Arms continuous, 10Arms peak, 48VDC (voltage not screened) | Both inputs are within the page’s current reference. Confirm the drive’s continuous/overload definitions, bus-voltage range, and thermal data in the intended housing before calling it a fit. |
| AGV steering motor | 10Arms continuous, 15Arms peak | The overload input exceeds the 10A reference. Compare a higher-rated drive and verify its overload curve, connector path, and braking requirements. |
| Medical pump | 2Arms continuous, 4Arms peak | Both inputs are below the reference. Compare lower-rated options against the same voltage, feedback, protocol, overload, and thermal requirements. |
Frequently Asked Questions
Next Steps
- For a compact-drive current screen before choosing an integration format, use the 10A compact servo drive sizing guide.
- Estimate supply-side current with the 10A BLDC servo drive current estimator before comparing it with a board-level drive’s winding RMS rating.
- Browse 48V servo driver boards to see physical connector options and layout footprint.
- Compare related drive families in the full servo drive product catalog.
- Review our Engineering Guidelines for TIM specifications and mounting hole layouts.
- If a bare board is too complex to integrate, consider a fully enclosed GaN servo drive with a built-in heat sink.
- Check humanoid robot joint requirements if the board-level drive is intended for a compact robotic actuator.
Inquiry Email
Include voltage, current, motor, encoder, protocol, board envelope, and quantity stage.